Ultraprecision Machining of Silicon Wafer by Micromilling Process

A. Golshan, B. T.H.T. Baharudin, H. Aoyama, M. K.A.M. Ariffin, M. I.S. Ismail, A. A. Ehsan

研究成果: Conference article査読

4 被引用数 (Scopus)

抄録

Silicon, being a material which allows light transmission beyond visible spectrum is a good candidate for the integration of microfluidic and optical devices. The lack of rapid prototyping method in particular mechanical-based micromachining process for silicon device processing is due to the brittleness property of silicon. Silicon fails or breaks without significant deformation when subjected to tension or stress. This study presents an experimental investigation on surface of micro-machined single-crystal silicon with (111) orientation. Full immersion slot milling was conducted using solid cubic boron nitride (CBN) micro-end mills. Influences of cutting parameters including spindle speed, feed rate and axial depth of cut on surface roughness were analyzed. Surface and subsurface characterization studies show that the primary material removal mode is ductile or partial ductile using lower feed rate.

本文言語English
ページ(範囲)192-196
ページ数5
ジャーナルProcedia Engineering
184
DOI
出版ステータスPublished - 2017
イベントAdvances in Material and Processing Technologies Conference, AMPT 2017 - Chennai, India
継続期間: 2017 12月 112017 12月 14

ASJC Scopus subject areas

  • 工学(全般)

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