Use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on a silicon substrate

S. Matsuo, K. Tateno, T. Nakahara, H. Tsuda, T. Kurokawa

研究成果: Article

28 引用 (Scopus)

抜粋

The use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on an Si substrate was demonstrated. The threshold current was 3.1mA and the maximum output power was 2.45mW for a 15μm diameter mesa. This technology is suitable for integrating photonic devices with an Si-LSI circuit.

元の言語English
ページ(範囲)1148-1149
ページ数2
ジャーナルElectronics Letters
33
発行部数13
DOI
出版物ステータスPublished - 1997 6 19
外部発表Yes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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