Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura, Hiroki Matsutani, Tadahiro Kuroda, Junichiro Kadomoto, Yusuke Matsushita, Hideharu Amano

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

本文言語English
ホスト出版物のタイトルProceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ページ195-201
ページ数7
ISBN(電子版)9781509026555
DOI
出版ステータスPublished - 2017 1月 13
イベント4th International Symposium on Computing and Networking, CANDAR 2016 - Hiroshima, Japan
継続期間: 2016 11月 222016 11月 25

出版物シリーズ

名前Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016

Other

Other4th International Symposium on Computing and Networking, CANDAR 2016
国/地域Japan
CityHiroshima
Period16/11/2216/11/25

ASJC Scopus subject areas

  • コンピュータ サイエンスの応用
  • ハードウェアとアーキテクチャ
  • 信号処理
  • コンピュータ ネットワークおよび通信

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