Wear mechanism of diamond tools in ductile machining of reaction-bonded silicon carbide

Zhiyu Zhang, Jiwang Yan, Tsunemoto Kuriyagawa

研究成果: Paper

1 引用 (Scopus)

抜粋

Wear mechanisms of single-crystal diamond tools in ductile machining of reaction-bonded silicon carbide (RB-SiC) were investigated. It was found that tool wear could be generally classified into two types. One is microchippings on the cutting edge, which were induced by micro impacts between the cutting edge and SiC grains. The other is two kinds of gradual wear patterns on flank face caused by different mechanisms: non-periodical scratches caused by scratching effects of the SiC grains, and periodical grooves caused by transcribing effect of tool feed marks on the machined surface. A tool-swinging cutting method was proposed to improve the service life of diamond tools.

元の言語English
出版物ステータスPublished - 2009 12 1
外部発表Yes
イベント5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 - Osaka, Japan
継続期間: 2009 12 22009 12 4

Other

Other5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009
Japan
Osaka
期間09/12/209/12/4

    フィンガープリント

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

これを引用

Zhang, Z., Yan, J., & Kuriyagawa, T. (2009). Wear mechanism of diamond tools in ductile machining of reaction-bonded silicon carbide. 論文発表場所 5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009, Osaka, Japan.