Wireless proximity communications for 3D system integration

Tadahiro Kuroda

    研究成果: Conference contribution

    5 被引用数 (Scopus)

    抄録

    Capacitive and inductive coupling I/Os are emerging non-contact parallel links for chips that are stacked in a package. The capacitive coupling utilizes a pair of electrodes that are formed by top layer of IC interconnections. The inductive coupling uses coils, just like a transformer, that are rolled by the IC interconnections. They are implemented by digital circuits in a standard CMOS. No new wafer process or mechanical process is required, and hence inexpensive. Since there is no pad exposed for contact, ESD protection structure can be removed. Chips under difference supply voltages can be directly connected, since they provide with an AC-coupling interface. This paper presents fundamental differences between the inductive coupling and the capacitive coupling. Secondly, advantages of the inductive coupling over Through-Silicon-Vias and micro-bumps are discussed. Circuit techniques to raise aggregated data rate to 1Tb/s, and lower energy dissipation to 0.14pJ/b are presented. Future challenges and opportunities such as a 3D scaling scenario are described.

    本文言語English
    ホスト出版物のタイトルRFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology
    ページ21-25
    ページ数5
    DOI
    出版ステータスPublished - 2007 12 1
    イベントIEEE International Workshop on Radio-Frequency Integration Technology, RFIT 2007 - Singapore, Singapore
    継続期間: 2007 12 92007 12 11

    出版物シリーズ

    名前RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology

    Other

    OtherIEEE International Workshop on Radio-Frequency Integration Technology, RFIT 2007
    国/地域Singapore
    CitySingapore
    Period07/12/907/12/11

    ASJC Scopus subject areas

    • コンピュータ ネットワークおよび通信
    • 電子工学および電気工学
    • 通信

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